Ibm uPD78082 Instrukcja Użytkownika Strona 26

  • Pobierz
  • Dodaj do moich podręczników
  • Drukuj
  • Strona
    / 274
  • Spis treści
  • BOOKMARKI
  • Oceniono. / 5. Na podstawie oceny klientów
Przeglądanie stron 25
3
CHAPTER 1 OUTLINE
1.4 Quality Grade
Part number Package Quality grade
µ
PD78081CU-××× 42-pin plastic shrink DIP (600 mil) Standard
µ
PD78081GB-×××-3B4 44-pin plastic QFP (10 × 10 mm) Standard
µ
PD78081GB-×××-3BS-MTX 44-pin plastic QFP (10 × 10 mm) Standard
µ
PD78082CU-××× 42-pin plastic shrink DIP (600 mil) Standard
µ
PD78082GB-×××-3B4 44-pin plastic QFP (10 × 10 mm) Standard
µ
PD78082GB-×××-3BS-MTX 44-pin plastic QFP (10 × 10 mm) Standard
µ
PD78P083CU 42-pin plastic shrink DIP (600 mil) Standard
µ
PD78P083DU 42-pin ceramic shrink DIP (with window) (600 mil) Not applicable
µ
PD78P083GB-3B4 44-pin plastic QFP (10 × 10 mm) Standard
µ
PD78P083GB-3BS-MTX 44-pin plastic QFP (10 × 10 mm) Standard
µ
PD78081GB(A)-×××-3B4 44-pin plastic QFP (10 × 10 mm) Special
µ
PD78082GB(A)-×××-3B4 44-pin plastic QFP (10 × 10 mm) Special
µ
PD78P083CU(A) 42-pin plastic shrink DIP (600 mil) Special
µ
PD78P083GB(A)-3B4 44-pin plastic QFP (10 × 10 mm) Special
µ
PD78P083GB(A)-3BS-MTX
Note
44-pin plastic QFP (10 × 10 mm) Special
µ
PD78081GB(A)-×××-3B4 44-pin plastic QFP (10 × 10 mm) Special
Note Under planning
Remark ××× indicates ROM code suffix.
Please refer to “Quality grade on NEC Semiconductor Devices” (Document number C11531E) published by
NEC Corporation to know the specification of quality grade on the devices and its recommended applications.
Przeglądanie stron 25
1 2 ... 21 22 23 24 25 26 27 28 29 30 31 ... 273 274

Komentarze do niniejszej Instrukcji

Brak uwag