IBM Intel Xeon E5506 Dokumentacja Strona 6
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6 Thermal/Mechanical Design Guide
Tables
1-1 Reference Documents ...............................................................................................10
1-2 Terms and Descriptions.............................................................................................10
4-1 Socket Component Mass............................................................................................27
4-2 1366-land Package and LGA1366 Socket Stackup Height ...............................................27
4-3 Socket and ILM Mechanical Specifications ....................................................................28
4-4 Electrical Requirements for LGA1366 Socket ................................................................29
5-1 Boundary Conditions and Performance Targets.............................................................31
5-2 Performance Expectations for 25.5 mm Tall Heatsink.....................................................33
5-3 Fan Speed Control, TCONTROL and DTS Relationship ....................................................39
5-4 T
CONTROL
Guidance ...................................................................................................39
6-1 Heatsink Test Conditions and Qualification Criteria........................................................43
A-1 Suppliers for the Intel Reference Thermal Solution........................................................47
A-2 Suppliers for the Intel Collaboration Thermal Solution ...................................................48
A-3 Suppliers for the Alternative Thermal Solution..............................................................48
A-4 LGA1366 Socket and ILM Components ........................................................................49
B-1 Mechanical Drawing List ............................................................................................51
C-1 Mechanical Drawing List ............................................................................................79
E-1 Boundary Conditions and Performance Targets.............................................................87
E-2 Embedded Heatsink Component Suppliers ...................................................................92
E-3 Mechanical Drawings List...........................................................................................92
- March 2009 1
- Contents 3
- Revision History 7
- 1 Introduction 9
- 1.1 References 10
- 1.2 Definition of Terms 10
- Introduction 12
- 2 LGA1366 Socket 13
- LGA1366 Socket 14
- 2.1 Board Layout 15
- 2.2 Attachment to Motherboard 16
- 2.3 Socket Components 16
- 2.3.3 Contacts 17
- 2.3.4 Pick and Place Cover 17
- 2.5 Durability 19
- 2.6 Markings 19
- 2.8 Socket Size 19
- 3 Independent Loading 21
- Threaded studs 23
- Clearance hole 23
- Threaded nuts 23
- Figure 3-3. ILM Assembly 24
- Protrusion 25
- 4 LGA1366 Socket and ILM 27
- 4.4 Loading Specifications 28
- 4.5 Electrical Requirements 28
- 5 Thermal Solutions 31
- Thermal Solutions 32
- 5.1.1 25.5 mm Tall Heatsink 33
- 5.2 Heat Pipe Considerations 34
- 5.3 Assembly 35
- 5.4 Structural Considerations 36
- 5.5 Thermal Design 36
- 5.5.2 Dual Thermal Profile 37
- 5.6 Thermal Features 38
- 5.6.1.1 T 39
- Guidance 39
- 5.7 Thermal Guidance 40
- 6 Quality and Reliability 43
- 6.2.2 Post-Test Pass Criteria 45
- A Component Suppliers 47
- Item Intel PN Foxconn Tyco 49
- Supplier Contact Info 49
- Component Suppliers 50
- B Mechanical Drawings 51
- Mechanical Drawings 52
- AS VIEWED FROM SECONDARY SIDE 54
- OF THE MOTHERBOARD 54
- (DETAILS) 54
- LEGEND, THIS SHEET ONLY 54
- SECONDARY SIDE 55
- 3D HEIGHT RESTRICTION ZONES 55
- PRIMARY SIDE 55
- 03D89880D 60
- SCREW, SHOULDER, M3 X 0.5 60
- C Socket Mechanical Drawings 79
- Socket Mechanical Drawings 80
- D Heatsink Load Metrology 85
- Heatsink Load Metrology 86
- E Embedded Thermal Solutions 87
- E.2 Thermal Design Guidelines 88
- Thermal Profile 89
- Embedded Thermal Solutions 90
- F Processor Installation Tool 97
- Processor Installation Tool 98
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